Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
نویسندگان
چکیده
منابع مشابه
Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints
A kinetic analysis was formulated for electromigration enhanced intermetallic evolution of a Cu–Sn diffusion couple in the Sn-based Pb-free solder joints with Cu under bump metallurgy. The simulated diffusion couple comprised the two terminal phases, Cu and Sn, as well as the two intermetallic phases, Cu3Sn and Cu6Sn5, formed between them. The diffusion and electromigration parameters were obta...
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Au (0.05 μm) 69.4 μm Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure. To better understand electromigration in SnPb and lead...
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Individual effect of thermomigration (TM) and combined effect of TM and electromigration (EM) on the microstructural variation in Sn8Zn3Bi was investigated by stressing line-type Au/Ni–P/Cu-Sn8Zn3Bi-Au/Ni–P/Ni solder joints with a 5 9 10 A/cm alternating current (AC) or direct current (DC) at 110 C. Due to the different thermoelectric characteristics of Cu and Ni wires, a thermal gradient of 19...
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Wafer Level Chip Scale Package (WLCSP) assemblies were tested under high temperature and high current conditions. Electromigration damage was observed along with accelerated diffusion and intermetallic compound growth at the solder / Under Bump Metallization (UBM) interface. Final electrical failure typically occurred due to a void created in the redistribution line (RDL) near the UBM. The fail...
متن کاملRecent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
A comprehensive kinetic analysis was established to investigate the electromigration (EM) enhanced intermetallic compound (IMC) growth and void formation for Sn-based Pb-free solder joints with Cu under bump metallization (UBM). The kinetic model takes into account Cu–Sn interdiffusion and current stressing. Derivation of the diffusion coefficients and the effective charge numbers for the inter...
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ژورنال
عنوان ژورنال: Journal of Welding and Joining
سال: 2021
ISSN: 2466-2232
DOI: 10.5781/jwj.2021.39.1.11